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Science 9 May 2008:
Vol. 320. no. 5877, pp. 756 - 757
DOI: 10.1126/science.1157129
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Perspectives

MATERIALS SCIENCE:
High-Frequency Chip Connections

Todd J. Spencer, Tyler Osborn, Paul A. Kohl

Advanced interconnects will be required to keep pace with the increasing speed of future microelectronics.

School of Chemical and Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA. E-mail: kohl{at}gatech.edu

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Science. ISSN 0036-8075 (print), 1095-9203 (online)